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  • aluminum nitride (ALN) thermal sheet φ35*1mm
    Aluminum nitride thermal conductivity ceramics have a high thermal conductivity of 180 W/m·K, making them one of the highest thermal conductivity materials among non-metallic substances (7-10 times that of aluminum oxide ceramics). They feature excellent mechanical properties, good machinability, high dimensional accuracy, a smooth surface, and no micro-cracks or warping. Their low dielectric constant and low dielectric loss ensure optimal electrical insulation performance. The material is environmentally friendly and non-toxic, can withstand temperatures up to 1800°C, is resistant to oil and chemical corrosion, and has a thermal expansion coefficient similar to silicon, with no hygroscopicity. It maintains stable performance and high reliability under high temperature and humidity conditions. With the widespread development of microelectronics, high thermal conductivity aluminum nitride ceramics are increasingly valued and used as substrate or packaging materials,such as aluminum nitride sheet,aln ceramic substrate,aluminum nitride thermal pad.      

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