aluminum nitride sheet

Aluminum nitride heat sinks are high thermal conductivity materials with high strength, high hardness, excellent wear resistance, and good corrosion resistance. Its thermal conductivity is extremely high, approximately five times that of aluminum and three times that of copper, making it one of the highest thermal conductive materials currently available. Additionally, aluminum nitride heat sinks possess very high strength, allowing them to withstand significant pressure and tensile forces without deforming or damaging easily. They also exhibit good corrosion and wear resistance, enabling them to operate stably in harsh environments for extended periods. Aluminum nitride heat sinks are widely used in various fields such as electronics, LED lighting, automotive electronics, and aerospace for heat dissipation and thermal management, particularly in high-power electronic devices. Due to their unique physical and chemical properties, they can quickly dissipate generated heat, maintaining a stable operating temperature for equipment while also extending its lifespan.      

Aluminum nitride thermal conductivity ceramics have a high thermal conductivity of 180 W/m·K, making them one of the highest thermal conductivity materials among non-metallic substances (7-10 times that of aluminum oxide ceramics). They feature excellent mechanical properties, good machinability, high dimensional accuracy, a smooth surface, and no micro-cracks or warping. Their low dielectric constant and low dielectric loss ensure optimal electrical insulation performance. The material is environmentally friendly and non-toxic, can withstand temperatures up to 1800°C, is resistant to oil and chemical corrosion, and has a thermal expansion coefficient similar to silicon, with no hygroscopicity. It maintains stable performance and high reliability under high temperature and humidity conditions. With the widespread development of microelectronics, high thermal conductivity aluminum nitride ceramics are increasingly valued and used as substrate or packaging materials,such as aluminum nitride sheet,aln ceramic substrate,aluminum nitride thermal pad.